Packaging Integration Engineer
Location: Palo Alto, CA
Department: Packaging & Ops
Cspeed IO is a stealth start up backed by Sutter Hills Ventures and Atreides Capital - headquartered in Palo Alto, CA. Our executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware.
Cspeed IO is developing next-generation optical semiconductor solutions for the AI infrastructure market, focused on enabling true “scale-up” architectures. Our mission is to replace traditional copper interconnects with advanced fiber-optic technologies that overcome the limitations of existing optics solutions and architectures.
Duties, Deliverables, and Responsibilities
● Drive Cspeed’s package from initial concept to production
● Help establish photonic and electronic co-design process flow
● Work with OSAT’s to define integration packaging design rules, process flow, and materials
● Lead optical package development to establish package manufacturability and reliability.
● Collaborate with cross-functional teams including of silicon photonics, IC design, layout, test and reliability to drive the package/integration forward
● Work with external foundries and OSAT’s on process integration and packaging for interposer
Expertise, Knowledge, and Skills
● Understanding of 2.5D and 3D packaging technologies, i.e. interposers, heterogeneous integration, high-density interconnects
● Ability to select and manage external foundries/OSATs for interposer-based packaging (must understand material selection, state of the art techniques, and advanced process flows required for advanced packaging)
● Must have strong program/project management skills (i.e. set schedule, maintain it, ensure parts arrive on time in the right place, etc.)
● Clear communication, ability to work cross-functionally and interface with design, SI/PI, testing, vendors, OSATs, etc
● Bonus: Familiarity with layout design for high-speed applications, simulation, mechanical and thermal analysis
Experience, Background, and Accomplishments
● Driven multiple 2.5/3D high-speed packages end to end, working with all roles on the packaging team (design, layout, SI/PI, test and reliability, etc.)
● Experience driving packages with unconventional needs / uncommon processes
● Experience working with large, established OSAT’s and foundries on custom processes and flows
● B.Sc.+ in EE or Materials or optics
● Bonus: experience with CPO packaging, integrated PIC + EIC package
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