Engineering Manager, Digital & Mixed-Signal Hardware
Team: Digital & Mixed-Signal Electronics
Location: Austin, TX
Commitment: Full-time
Workplace Type: onsite
JOB DUTIES AND RESPONSIBILITIES
- Maintain technical integrity and engineering excellence for high-speed digital and mixed-signal electronics development across the company.
- Establish, mature, scale, and enforce engineer-friendly digital hardware development processes, including high-speed interface design guidelines, signal integrity simulation workflows, and schematic and layout standards for dense, high-layer-count PCBs
- Lead and participate in rigorous architecture and design reviews, ensuring appropriate subject matter expert (SME) engagement across digital, RF, power, firmware, and mechanical disciplines.
- Provide system-level technical leadership for software-defined radio and computing units and phased array control architectures.
- Apply strong working knowledge of adjacent disciplines—RF electronics, power electronics, thermal/mechanical engineering, firmware/software—to ensure board- and system-level success.
- Contribute directly to board-level digital and mixed-signal designs as needed, particularly in high-risk or schedule-critical programs.
- Lead or support complex debug efforts involving high-speed interfaces, large FPGA and processor implementations, and related technical topics.
- Ensure digital hardware designs are buildable and testable at scale using DFM and DFT best practices.
- Drive disciplined handoff from engineering to manufacturing through close collaboration with manufacturing engineering, supply chain, and production test engineering.
- Ensure designs meet quality, reliability, and scalability requirements for aerospace and defense production environments.
- Lead digital architecture decisions aligned with product performance and long-term technology roadmaps.
- Partner with Supply Chain to ensure component availability, lifecycle risk mitigation, and cost awareness.
- Drive design reuse, modular architectures, and platform commonality across products to accelerate execution and reduce risk.
TEAM LEADERSHIP, STAFFING & PERFORMANCE RESPONSIBILITIES
- Build, scale, and lead a high-performing digital and mixed-signal hardware engineering team.
- Advocate for realistic schedules while holding the team accountable to delivery commitments.
- Lead hiring activities, including writing job descriptions, conducting interviews, and making hire/no-hire decisions.
- Establish clear development paths and growth opportunities for high-performing engineers.
- Address performance issues promptly and constructively.
- Actively close skill gaps through hands-on contribution, training initiatives, or targeted hiring.
- Provide one-on-one coaching, mentoring, and deep technical guidance.
- Serve as a key contributor to early-stage engineering execution planning, including collaboration with Business Development and Systems Engineering.
- Plan and manage budgets related to staffing, lab equipment, capital equipment, and design/simulation software.
- Maintain strong working relationships across Engineering, Quality, and Operations.
JOB REQUIREMENTS AND MINIMUM QUALIFICATIONS
- Bachelor’s degree or higher in Electrical Engineering or Computer Engineering required.
- Minimum of 7–9 years of progressive digital or mixed-signal hardware engineering experience, preferably in aerospace environments, including 1–3 years of leadership or engineering management experience preferred.
- Demonstrated deep expertise in high-speed digital and mixed-signal board design.
- Software-defined radio experience preferred.
- Strong understanding of signal integrity (SI) and timing.
- Experience supporting design for manufacturability (DFM), design for test (DFT), and transition from development to production.
- Proven ability to conduct rigorous technical reviews, mentor engineers, and communicate effectively across disciplines.
- Ability to balance architectural rigor with execution speed in a fast-paced development environment.
- Proficiency with high-speed simulation and analysis tools such as Ansys SiWave or ADS SiPro.
- Hands-on experience with schematic capture and PCB layout tools such as Altium.
- Familiarity with product lifecycle management (PLM) systems required.
- Familiarity with FPGA toolchains (e.g. Xilinx Vivado) preferred.
- Strong technical and non-technical communication skills.
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