3D Integration Engineer

Team: Chip Design

Location: Paris

Commitment: Full - time

Workplace Type: onsite

Your role at C12 Quantum Electronics:

We are seeking a 3D Integration Engineer to develop advanced packaging and heterogeneous-integration technologies for scalable quantum-computing hardware.

You will design and optimize interconnects between quantum devices, control electronics, photonic components, and cryogenic systems while maintaining signal integrity, thermal performance and reliability.

 
Key responsibilities:
You will develop 2.5D and 3D integration architectures for quantum processors and supporting electronics.
You will design interposers, through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces.
You will integrate our QPU with other chip modality with cryogenic CMOS, RF/microwave circuitry, photonics, MEMS, and packaging substrates.
You will perform electrical, electromagnetic, mechanical, and thermal simulations.
You will define fabrication flows and design rules with foundries, packaging partners, and internal process teams.
You will develop test vehicles and perform experimental measurements on those fabricated devices, analyze experimental data to improve yield and performance.
You will document designs, process specifications, qualification results, and technology roadmaps.
You will collaborate with quantum-device, circuit-design, cryogenic, materials, manufacturing, and systems teams.

About you:

• You have a Bachelor’s or Master’s degree in electrical engineering, materials science, mechanical engineering, applied physics, or a related discipline.
• You have experience in semiconductor packaging, wafer-level integration, MEMS, microfabrication, or heterogeneous integration.
• You are familiar with one or more relevant processes: wafer bonding, hybrid bonding, TSVs, flip-chip assembly, thin-film deposition, lithography, etching, electroplating, or CMP.
• You are familiar with package-level electrical, thermal, and mechanical design.
• You have experience with CAD, electromagnetic simulation tools, multiphysics simulation, statistical analysis, or semiconductor process-development tools.
• You have strong experimental, troubleshooting, documentation, and cross-functional communication skills.
 
Really nice to have: 
• PhD or equivalent industry experience in advanced packaging or semiconductor integration.
• Experience with superconducting, semiconductor-spin, trapped-ion, neutral-atom, or photonic quantum-computing platforms.
• Experience with RF/microwave interconnects, photonic coupling, or high-density chiplet systems.
• Experience transferring a packaging or integration process from research into pilot or volume manufacturing.

What we offer:

 

• 60,000 euros - 78,000 euros yearly base salary
• Stock options for every employee (BSPCE/ESOP)
• Sponsored trip to conferences around the world
• A highly dynamic international team
• Swile meal vouchers
• Mental health support with moka.care
• Training budget/ Annual Learning & Development Allowance
• Sabbatical leave (after 2 years in the company)
• Vibrant office culture (two office spaces in the heart of Paris, team lunches, offsite events, Friday breakfasts..)

You should join us if...

You want to have a key role in a growing startup with challenges at the frontier of the technology.
You want to contribute to achieving landmark results in quantum computing, making a difference in the emerging quantum technologies.
You want to work within a 60-people team with various backgrounds in nanofabrication, quantum electronics, and carbon nanotube science to create a revolutionary quantum computing processor.
You want to thrive in an exceptional scientific environment with several industrial and academic partners.
You share our values (excellence, scientific integrity, diversity, curiosity, and care) and want to help us define our product-focused culture and ambition to accelerate.
We still encourage even if you don’t meet all the requirements. Rest assured, we are committed to finding the right fit for our team and are open to adjusting compensations based on skills and experiences. Applications from women are especially welcomed!