ChipFab Product Engineer

Location: Malaysia-Penang B 1 & 2

Time Type: Full time

Job Description

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Job Description:

Job Description 

• New Facilities & Production Ramp-Up: Lead the team to ramp-up new facilities, ensuring aggressive capacity scaling are consistently achieved within strict project timelines.
• New Equipment, Process & CM Qualification: Lead the cross functional team in the evaluation, qualification, and strategic onboarding of new Contract Manufacturing (CM) partners, new equipment, and manufacturing processes to ensure a seamless transition into mass production.
• New Product Transfer & Technical Ownership: Drive for seamless transition of products from New Product Introduction (NPI) to High-Volume Manufacturing (HVM), acting as the first line of technical defense for all product-related issues on the factory floor.
• Yield Stabilization & Enhancement: Monitor production yields across contract manufacturers. Proactively identify yield issue such as Low Yield Triggered , On-Hold Rate, Rework Rate and drive for improvement.
• Line Sustaining, drive for process yield Improvement : Resolve daily CM engineering, production, and quality issues by implementing robust corrective actions and driving continuous process improvement initiatives.
• Product Costing Management: Oversee product cost analysis and proactively identify opportunities for cost reduction through process optimization, yield enhancement, and cycle time improvements.
• Data-Driven Engineering Analysis: Drive to monitor CM performance metrics and troubleshoot complex manufacturing deviations utilizing advanced analytical software (e.g., JMP).
• Customer Quality Assurance: Conduct rigorous on-site quality audits at partner facilities to enforce strict adherence to Standard Operating Procedures (SOPs), Process Control Plans (PCPs), and overarching quality standards. Drive Contract Manufacturers (CMs) to promptly resolve customer quality issues by leading root cause investigations, implementing robust corrective actions (CA), and tracking their long-term effectiveness.

Requirement

• Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or a related highly technical field.
• Minimum 10+ years of hands-on engineering and leadership experience in backend Indium Phosphide InP wafer processing (from wafer to chip-out) or complex semiconductor/photonics manufacturing. Familiarity with Bar Processing such Bar Stacker/unstack, Scribe & Break, AOI, and Pick & Place will be an added advantage. 
• Strong leadership capabilities with a proven history of managing remote teams, driving cross-functional initiatives, and successfully leading new facility or production line ramp-ups.
• Extensive expertise in product and process yield improvement methodologies, complex problem-solving, and equipment qualification.
• Highly proficient in JMP software, with a strong capability to leverage it for complex statistical data analysis and critical decision-making.
• Excellent communication, negotiation, and project management skills, with the ability to influence external partners and internal stakeholders effectively.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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