In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution.
- Participate in finalizing the selection of film deposition related equipment to be purchased by Black Semiconductor GmbH. Review/Negotiate/Approve the acceptance test protocols with vendors prior to submission of finalized order. (0-3 months)
- Hire a team of Process Engineers & Equipment Engineers to support the varied deposition needs in our pilot line facility. (3-9 months)
- Establish procurement relationships with consumable vendors and coordinate preparation activities to ensure the turn on of our pilot line is as smooth as possible. (3-12 months)
- Contribute to the standardization of working methodology across the fab-engineering organization along with your peers leading teams in other manufacturing areas. (3-9 months)
- Execute process-baselining with your team for all film deposition layers as they become required by the pilot line. Rapidly evolve recipes to deliver a first viable and stable process and focus on documenting and automating and standardizing always with the objective of tightening the variation of what is delivered. (SPC, 8D, FMEA) (12-24 months)
- Develop your skillset and the skillset of your team members in adjacent areas of the manufacturing line where beside those with day-to-day ownership. Share ideas and skills across the organization, support professional development, and creates effective redundancy. (12+ months)
- Prioritize process improvement needs through discussion with multidisciplinary colleagues and use a project-based work format to introduce them to the line. Ensures the quality of work done conforms to BLK engineering protocols. (18+ months)
- In a start-up environment, fill gaps by occasionally taking on tasks outside your usual responsibilities. Communicate frequently about evolving needs. expectations, and the complex network of dependencies. (0+ months)
- 8+ years direct experience in varied thin-film engineering roles in a semiconductor 200 or 300 mm fab.
- "PhD or MSc graduate degree in following or related fields: Electrical, Chemical, Mechanical, Materials Engineering, Physics, and Chemistry. BSc degree followed by significant industrial experience welcome".
- Previous experience in people management, or as a process/equipment individual contributor developing leadership skills through project management.
- Experience with PVD, CVD and PECVD deposition of liner, plug and dielectric films commonly present in MOL and BEOL. (Please state explicitly the systems you are familiar with in the cover letter)
- Experience with ALD of high-K dielectrics and aware of the challenges posed by integration of 2D materials.
- Working knowledge and practical experience with FMEA, SPC, DOE, and statistically supported hypothesis testing. (effectively leverage tools such as JMP)
- Able to occasionally work in a clean room environment, wear clean room attire, adhere to strict contamination protocols.
- Flexibility in your schedule to interact with colleagues on multiple shifts face-to-face when needed.
- Proficient use of English Language.
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