Senior Failure Analysis (FA) Engineer

Who we are

About BBPOS

BBPOS is one of the world leaders in payment devices and the inventors of mPOS technology. BBPOS products are used by large retailers and leading online platforms across multiple industries.  BBPOS is engaged in the business of manufacturing and supplying mobile and smart point-of-sale hardware, and the underlying software and infrastructure to deploy, manage, and monitor those devices.  BBPOS is now part of Stripe’s Terminal business since the acquisition in March 2022.  

About the team

Post acquisition, the BBPOS team is now an extension of the Stripe Terminal team.  Stripe Terminal helps Stripe users extend their online presence into the physical world. The Terminal team’s mission is to make it as easy for businesses to accept in-person payments as the Stripe API has done for online payments. With Terminal, businesses can unlock in-person payments use cases that are right for their business model—whether it’s creating a flagship retail experience, extending their website to a pop-up store, or enabling a mobile point-of-sale at their next event. 

Stripe is a financial infrastructure platform for businesses. Millions of companies—from the world’s largest enterprises to the most ambitious startups—use Stripe to accept payments, grow their revenue, and accelerate new business opportunities.

What you’ll do

We are seeking a Senior Failure Analysis (FA) Engineer with extensive experience in managing the device FA activities and capabilities. This role involves device reliability and managing all the issues by providing FA planning, resources arrangement, result summary and FA data analysis. This person will also develop the preliminary FA capabilities to ensure in-house test efficiency and high quality output result. 

• Overall manage all FA activities start from failure data collection, instruct the FA flow, coordinate the resources and completion of report.
• Ensure high quality and timely analysis of Failure Analysis requests including detailed reporting of failure analysis results
• Ensure efficient communication with key stakeholders internally and externally (CM, 3rd Party)
• Comply with time tracking procedures for all FA work performed and delight stakeholders
• Implement the failure analysis process and provide high quality FA result
• Prepare and maintain Arena, Jira programs
• Technical leader who can teach and instruct the FA process
• Set up in-house key FA capabilities start from D&P, x-section

Who you are

We’re looking for someone who meets the minimum requirements to be considered for the role. If you meet these requirements, you are encouraged to apply. The preferred qualifications are a bonus, not a requirement.

Minimum requirements

• BS/BA academic background with 6+ years of electronics FA experience or MS/MA with 4+ years of electronics FA experience
• With at least 4 years in printed circuit board assembly (PCBA) failure analysis to include but not limited to, PCB failures, component failures, solder joint failure analysis, and contamination analysis
• Experience with R&D lab tests and equipment – high resolution Scope, D&P, X-section, Lapping, EDX, TDR, IV, LIT, SEM; Hands on experience is preferred
• Experience with failure analysis flow and RMA processes, able to design FA procedures based on failure mode and mechanism. 
• Fluent English speaking and presentation skills are required. 
• Willing to travel 50%.

Preferred qualifications

• PCBA, Camera or LCD FA experience is preferred; 
• Battery testing or FA experience related to charging/discharging, bulge, leakage, contamination Issues management; 
• Familiar with reliability tests including environmental HTHH, THB, ATC, dynamic Shock and vibration, endurance, fatigue on component and board level testing