Packaging Engineering Intern - Fall 2024

About Atomic Semi

Atomic Semi is building a small, fast semiconductor fab.

It’s already possible to build this with today’s technology and a few simplifications. We’ll build the tools ourselves so we can quickly iterate and improve.

We’re building a small team of exceptional, hands-on engineers to make this happen. Mechanical, electrical, hardware, computer, and process. We’ll own the stack from atoms to architecture. Our team is optimistic about the future and we want to continue pushing the limits of technology.

Smaller is better. Faster is better. Building it ourselves is better.

We believe our team and lab can build anything. We’ve set up 3D printers, a wide array of microscopes, e-beam writers, general fabrication equipment - and whatever is missing, we’ll just invent along the way.

Atomic was founded by Sam Zeloof and Jim Keller. Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years.

About the role

We’re hiring process engineering interns focused on the packaging for the fall term. We are a small team engaged in end-to-end process development integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies.

This is a hands-on process engineering role -- meaning you will be actively involved in design-of-experiments, data analysis, research, and processing. We train our interns on most of our tools and allow them to use these tools independently, including metal plating, deposition, and metrology.

Responsibilities

• Designing experiments (analyzing data and current processes, consulting theory and reading papers to decide next steps, etc.)

• Hands-on wafer/package processing (deposition, etch, lithography, metrology)

• Incremental process improvement (tuning recipes for optimal performance/yield)

• Analyzing experimental data and determining next steps

Required qualifications

• Pursuing a Bachelor’s Degree or higher in engineering

• At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices

• Hands-on experience with wafer fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.). You should have been trained and used these tools independently in your previous experience.

Desired qualifications

• Reliability testing, soldering, and reflow testing

• Familiarity with lasering and 3D printing(stereolithography) is a plus