High Speed Data Connector SI/EMC Design Engineer

Location: Wuppertal, Germany

Time Type: Full time

Job Description

Major Accountabilities

• Guidance of high speed data interconnect design & optimization in terms of Signal Integrity (SI) and Electromagnetic Compatibility (EMC) in close cooperation with the international and interdisciplinary product development team
  • Analysis and evaluation of SI/EMC related requirements (from customer RFQs, standards, workgroups etc.)
  • Execution of fundamental investigations and feasibility studies for design concepts
  • Identification of relevant design parameters, dimensions and tolerances having critical impact on performance
  • Determination of potential optimizations considering costs, quality, manufacturability, mechanical and other constraints
• SI and EMC simulations of high speed data connectors, cable assemblies and PCBs in high frequency range (up to 20 GHz and beyond)
• Participation at critical milestones of the product development process
  (e.g. concept reviews, design reviews, DFM meetings and DFMEAs)
• Alignment of simulation results with SI/EMC measurement results of physical samples and root cause analysis of failures and deviations
• Creation of SI/EMC design guidelines for high speed data connectors, cable assemblies and PCBs and provide trainings for product and application engineers
• Improvement and automation of methods and procedures for the characterization, modeling, simulation, analysis and design of interconnections considering artificial intelligence based approaches
• Participation in work groups and standardization committees such as Open Alliance, MIPI or ASA

Qualifications:

• Essential Skills
  • Master degree in electrical or telecommunications engineering or bachelor degree with relevant experience in cable/device connector development
  • At least 3 years of professional experience in high-speed data communication
    (e.g. in automotive, telecommunication, PCB design)
  • Proficient handling of electromagnetic field simulation tools (preferably ANSYS HFSS, optionally CST Microwave Studio or others)
  • Substantial theoretical background on electromagnetics and numerical methodszu
  • Knowledge of SI/EMC standards and specifications (e.g. Open Alliance)
  • Strong analytical skills
  • Willingness to travel (e.g. to customers, suppliers, workgroups, conferences)
  • Business fluent English and good German language skills
  • Good intercultural skills and team player

• Optional Skills
  • Experience with RF test equipment for SI and EMC measurements (vector network analyzer, TDR, oscilloscope, tube/triaxial cell etc.)
  • Knowledge of PCB design and simulation tools (e.g. Mentor Xpedition, HyperLynx, Spice)
  • Knowledge of requirements management tools (e.g. Polarion, Doors)
  • Experience in programming/scripting languages (e.g. VBA, Python)

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