Wet Clean Technology Development​ Process Engineer

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service manufacturing equipment for the semiconductor and display industries. Our innovations are at the foundation of the technology that transforms every part of our lives. We offer an exciting place to grow and learn alongside some of the best people you’ll ever meet. Join us to Make Possible a Better Future.

The Advanced Packaging Development Center (APDC) is a state-of-the-art cleanroom that is among the most advanced wafer-level packaging labs in the world. It houses the industry’s broadest portfolio of products that enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding. APDC was established as a joint lab partnership with the Institute of Microelectronics (IME), a research institute of Singapore’s Agency for Science, Technology and Research (A*STAR).

We are currently seeking for an experienced and passionate Wet Clean Technology Development​ Process Engineer to join APDC now. Apply now if you fit the description below!

Key Responsibilities

• In-depth understand a set of unique challenges of wet clean processes for both conventional and unconventional test vehicles in CoW hybrid bonding applications.

• Propose solutions to address the unique challenges of wet cleaning for high-yield hybrid bonding and die stacking using the current generation wet clean module. Proactively initiate and conduct CnF tests to define process & hardware requirements.

• Collaborate with partners to evaluate different wet clean technologies to identify the best wet clean technology​ and process for HBM.

• Deep dive with engineering team and/ or supplier to prototype next gen wet cleans module based on identified technology and process & hardware requirements.

• Evaluate proto chamber for hybrid bonding process for HBM. Own process optimization and drive engineering improvement.

• Wet cleans technology & process subject-matter expect to guide account/field teams on tough wet clean and defectivity related technical issues.

Functional Knowledge

• Good understanding of FEOL wet cleans concept and particle removal is essential.

• Familiar with defectivity characterization (such as Surfscan, AOI, eDR, SEM review) and methodology.

• An industrial track record with hands-on development experience of any wet clean technology is strongly desirable.

• Ability to read fluid diagram is very helpful.

• Any background of WoW or CoW bonding is a bonus.

Opportunities

• On-job training on CoW hybrid bonding processes and challenges. Hands-on on the state-of-the-art integrated hybrid bonder to witness and contribute to the historical industrial inflection from micro-bump to hybrid bonding.

• Oversea training in US by wet clean process experts through OJT.

• Technical training on/ exposure to up & downstream integration processes and interaction with hybrid bonding.

• Patent filing to protect innovative ideas for this new field is encouraged.

Requirements

• Engineering or science university educational background.

• > 3 years industrial experiences on wet cleans technology.

• Backgrounds on wet cleans process and/or hardware development is strongly preferred.

• Backgrounds on defectivity improvement is appreciated.

• 10% travel commitment to the US, Taiwan, Korea or Europe.

Working Location

• Science Park II, Singapore (till 2026). Tampines (after 2026)

Qualifications

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Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.