In the R&D Group, we are focused on developing next-generation processes and materials to enable future semiconductor technology nodes. Our team combines experimental process development, advanced metrology, and computational modeling to solve critical challenges in next generation lithography and materials modification processes for advanced nanofabrication and future device architectures. We work at the intersection of materials science, plasma physics, and surface engineering to accelerate innovation from concept through feasibility testing and customer application development. 

What You'll Do 

• Conduct research and support novel semiconductor processes, focusing on patterning and material modification, for future device architectures. 

• Perform thin-film characterization using FTIR, Raman, XPS, XRR, ellipsometry, SEM, TEM, and related techniques. 

• Design and execute experiments using Design of Experiments (DOE) methodologies and analyze data using advanced data analytics tools (Python, MATLAB & JMP). 

• Collaborate with cross-functional teams including lithography, etch, deposition, materials science, computational modeling, and customer application groups. 

• Present technical findings to internal stakeholders, with opportunities to contribute to patents and conference presentation.

• Available for a 6 to 9 month co-op term on-site at our Gloucester location

Who We're Looking For 

• Currently pursuing a PhD in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Materials Science, Chemistry, or Physics. 

• Must be currently enrolled in a PhD program and available to work full-time for a 6–9 month internship/co-op assignment. 

• Research experience in semiconductor processing, thin-film materials, plasma science or advanced characterization techniques.  

• Proficiency in scientific programming and data analysis using Python, MATLAB, or similar computational tools. 

• Strong analytical and problem-solving skills with the ability to independently design and execute technical investigations. 

• Comfortable working in shared research facilities, adhering to cleanroom protocols, and quickly learning new equipment/processes/procedures.  

• Strong written and verbal communication skills, with the ability to effectively present technical findings across multidisciplinary teams. 

Preferred Qualifications 

• Background in semiconductor processing technologies, including ion implantation, lithography, reactive-ion etch (RIE), chemical vapor deposition (CVD/PECVD), atomic layer deposition (ALD), and other semiconductor fabrication methods. 

• Strong record of research accomplishments demonstrated through publications, conference presentations, patents, or other scholarly contributions. 

• Candidates from diverse backgrounds, with fresh perspectives, and with a passion for semiconductor R&D are strongly encouraged to apply!