Primary Responsibilities:

• Manage new product introduction and volume production support engineering for a specific product or group of products after transferring from design to in-house or outsourced production.

• Interface with design, process, test, reliability, and manufacturing engineering to solve product issues and production problems as the product(s) move from design and development, to completion, release, and high-volume production.

• Develop and sustain process improvements to reduce production costs and increase yields. Conduct low yield root cause analysis for volume production products, process transfer and product transfer between fabrications.

  • Define problems by identifying failure modes, quantity of material affected, percent fallout, financial impact, etc.

  • Perform data analysis on yield, test data, and fabrication electrical device data and tool data using statistical data analysis software or self-developed program.

  • Perform circuit analysis on a variety of analog and mixed signal integrated circuits by using electronic design tools.

  • Utilize precision measurement equipment and apply measurement techniques and tools required to establish different analog, power, RF, or digital performance metrics to evaluate and collect measurements of device operations to validate the failures.

  • Perform fault isolation and physical failure analysis to determine the root cause from material perspective.

  • Drive future preventive action and solution: improve test, design, and processes to achieve the best quality and the lowest cost.

Partial telecommute benefit (2 days/week work from home).

Education and Experience Requirements

Master’s degree in Electrical Engineering, Materials Science, Device Physics or a closely related technical discipline and two (2) years of experience as a product engineer or related occupation performing mixed signal circuit debugging and physical failure analysis.

Required Skills:

• Demonstrated Experience (DE) analyzing manufacturing statistics using Klarity ACE, Galaxy Examinator, and PDF Solutions Exensio to perform correlation analysis between fab process data and yield, and pareto analysis to identify the top failing events.

• DE performing mixed integrated circuit (IC) and modeling and simulation using Cadence, Avalon, Console, and Advanced Design System (ADS).

• DE performing evaluation and characterization using bench test equipment including signal generators, spectrum analyzers, oscilloscopes, and power meters controlled and automated by Python/LabView/Teststand and/or other programming languages

• DE performing failure analysis of analog/mixed signal integrated circuits by conducting fault isolation using techniques such as OBIRCH, EMMI, X-Ray and Thermal Hotspot and leveraging principles of semiconductor device physics and transistor level analog circuit.

• DE performing mechanical and chemical de-processing, parallel polishing, utilizing high-resolution scanning electron microscope (SEM) and focused ion beam (FIB) and related techniques such as passive voltage contrast (PVC), Energy-dispersive X-ray spectroscopy (EDX), and in-situ nanoprobing to characterize and interpret the microstructure and material properties of the semiconductor device

• DE Strong communication skills and ability to collaborate across different organizations to drive problem resolution.