Analog Devices: Mixed-signal and digital signal processing ICs logo

Principal Engineer, Failure Analysis Engineering

Analog Devices: Mixed-signal and digital signal processing ICs

On-site
Milpitas, CA
Full-time
Principal
5+ yrs
$160k–$232kPosted 4h ago

Real job — pulled straight from Analog Devices: Mixed-signal and digital signal processing ICs’s careers page · Verified September 20, 2026 · No reposts.

Job description

Analog Devices: Mixed-signal and digital signal processing ICs is hiring a Principal Engineer, Failure Analysis Engineering — a full-time, based in Milpitas, CA role ($160k–$232k). Apply directly on Analog Devices: Mixed-signal and digital signal processing ICs's careers page below.

Principal Engineer, Failure Analysis Engineering

Location: US, CA, Milpitas, Tasman

Time Type: Full time

Job Description

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

Roles and Responsibilities:

  • Support root cause failure investigations arising from reliability testing, manufacturing, and field returns.
  • Develop and execute detailed failure analysis plans.
  • Coordinate / conduct hands-on physical and electrical failure analysis (FA) using a variety of tools in-house and at outside labs (e.g., SEM, EDS, CSAM, X-ray, bench characterization).
  • Perform material and defect characterization to identify failure modes in semiconductors, packages, and assemblies.
  • Prepare clear and technically sound failure analysis reports for internal and external stakeholders.
  • Execute product qualification and reliability stress testing on semiconductor products (e.g., HTOL, TC, HAST).
  • Collaborate with design, manufacturing, test, and quality engineering teams to ensure robust failure resolution.
  • Support corrective and preventive actions (CAPA) based on FA findings. Generate 8D corrective action reports. 
  • Assist with customer communications to resolve quality issues and provide technical insights.
  • Contribute to continuous improvement initiatives in product reliability, analysis methodologies, and lab capability development.

Basic Qualifications:

  • Bachelor’s degree in Electrical Engineering, Materials Science, Physics, or a related STEM discipline.
  • 5 years of industry experience in semiconductor reliability or failure analysis.
  • Hands-on experience with FA techniques such as:
    • Material analysis: SEM, EDS, optical profiler.
    • Electrical testing: Oscilloscopes, curve tracers, thermal imaging.
    • Fault isolation: Photon emission, OBIRCH, X-ray, CSAM.
  • Understanding of semiconductor device physics, packaging technologies, and common failure mechanisms (physics of failure).
  • Experience analyzing failures caused by thermal, electrical, and mechanical stress.
  • Familiar with JEDEC reliability standards and procedures.
  • Project management experience with external reliability and FA labs. 
  • Strong statistical data analysis capability. Experience with data analysis packages (JMP, Python, etc.). 
  • Strong technical writing skills and ability to create detailed FA documentation, reliability reports, and qualification reports.
  • Good verbal communication skills and ability to work in cross-functional teams.
  • Demonstrated organizational skills, with the ability to handle and prioritize multiple projects simultaneously in a timely manner in a fast-paced environment.

Preferred Qualifications:

  • Master’s or Ph. D. degree in Electrical Engineering, Physics, or Materials Science.
  • Experience with power and/or analog/mixed-signal ICs, or power IC failure modes.
  • Experience with SiP architecture Reliability/FA and packaging failure mechanisms (e.g., electromigration, delamination).
  • Experience supporting customer quality investigations and field return analysis.
  • Prior reliability test and FA engagements with OSAT suppliers a plus. 
  • Exposure to reliability modeling and risk assessment methods such as FMEA, DOE, and Weibull analysis.
  • HTOL and HAST board layout and schematic interpretation.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $160,276 to $232,087.
  • Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

  • This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.

  • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

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Frequently asked questions

What is the salary for Principal Engineer, Failure Analysis Engineering at Analog Devices: Mixed-signal and digital signal processing ICs?

The estimated salary range for Principal Engineer, Failure Analysis Engineering at Analog Devices: Mixed-signal and digital signal processing ICs is $160,000 - $232,000 USD per year.

What skills are required for Principal Engineer, Failure Analysis Engineering at Analog Devices: Mixed-signal and digital signal processing ICs?

The required skills for Principal Engineer, Failure Analysis Engineering at Analog Devices: Mixed-signal and digital signal processing ICs include: SEM, Python, Electrical Engineering, Project Management.

What is the seniority level for Principal Engineer, Failure Analysis Engineering at Analog Devices: Mixed-signal and digital signal processing ICs?

Principal Engineer, Failure Analysis Engineering at Analog Devices: Mixed-signal and digital signal processing ICs is a Principal level position.

How do I apply for Principal Engineer, Failure Analysis Engineering at Analog Devices: Mixed-signal and digital signal processing ICs?

You can view the full description and apply for Principal Engineer, Failure Analysis Engineering at Analog Devices: Mixed-signal and digital signal processing ICs on EchoJobs: https://echojobs.io/job/analog-devices-mixed-signal-and-digital-signal-processing-ics-principal-engineer-failure-analysis-engineering-eprp1.