Sr PCB Manufacturing Process Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. AMD together we advance_ THE TEAM AMD's Data Center GPU organization is transforming the industry with our AI based Graphic Processors. Our primary objective is to design exceptional products that drive the evolution of computing experiences, serving as the cornerstone for enterprise Data Centers, (AI) Artificial Intelligence, HPC and Embedded systems. If this resonates with you, come and joining our Data Center GPU organization where we are building amazing AI powered products with amazing people. THE ROLE AMD’s Data Center GPU and Accelerated Processing (DCGAP) division is looking for a talented and energetic Lead Printed Circuit Board (PCB) manufacturing process engineer to complement the existing skillsets of our Platform Development team. In this role, you will be responsible for driving the development of PCB performance, quality and reliability specifications, including high-speed signal integrity optimized board stacks and interconnect structures for mass volume manufacturing. To accomplish this, you will need to interact frequently with key engineering teams such as silicon design, boarding engineering, SI/PI engineering, system validation, device failure analysis and supply chain/manufacturing leaders within AMD, industry consortiums, our customer teams, and strategic ODM and joint development partners. THE PERSON PCB Manufacturing Engineers are responsible for ensuring best-in-class performance and reliability of cutting-edge PCB designs. The suitable candidate will require a strong background in high performance electronics hardware, technical expertise in PCB assembly reliability test/failure analyses, and understanding of complex PCB fabrication processes. Effective communication skills, a collaborative mindset, detail-orientation, innovative critical problem solving/ troubleshooting, and organized data collection are critical qualities for success in this role. KEY RESPONSIBILITIES Design high performance PCB stack and interconnect solutions to enable AMD's next generation of Datacenter GPU Platforms Own manufacturing process qualification & adoption of PCB process technologies addressing product thermal-mechanical, and SI/PI-related performance specifications Identify and investigate novel PCB fabrication process techniques to evaluate alignment of these technologies to AMD’s DCGPU Platform roadmap Collaborate with silicon design engineering, board engineering, power engineering and other cross-functional teams to support PCB solutions from package to system level Contribute to the overall product cycle from conceptualization through mass production Drive process improvements while executing fast time-to-market product delivery Work effectively in a dynamic and fast-paced product development environment PREFERRED EXPERIENCE The selected candidate will use their proven technical skills to ensure engineering teams continually innovate and use ‘best known methods/practices’, thereby adding value for customers. Strong background in high-speed PCB design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use Expertise in destructive and non-destructive device failure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA etc), and FTIR Spectroscopy Familiarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for Signal Integrity and Power Delivery-focused interconnect optimizations Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for statistical data analysis & tool development Excellent verbal & written communication skills at engineering and executive levels, including a proven track record of working effectively across organizational boundaries to define process requirements, solve complex problems and drive program-related investigations to successful completion Laboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis Manufacturing - Sound knowledge of Design for Manufacturing guidelines, including experience with volume manufacturing in Asia as well as in North America ACADEMIC CREDENTIALS B. Sc. in Engineering (Electrical/Computer/Mechanical/Chemical…etc.) is required MS in Electrical/Electronics and Computer Engineering is preferred LOCATION Austin Texas or Hybrid (Remote + occasional travel to Austin TX, other North America & international locations) #LI-RW1 #LI-HYBRID At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE TEAM AMD's Data Center GPU organization is transforming the industry with our AI based Graphic Processors. Our primary objective is to design exceptional products that drive the evolution of computing experiences, serving as the cornerstone for enterprise Data Centers, (AI) Artificial Intelligence, HPC and Embedded systems. If this resonates with you, come and joining our Data Center GPU organization where we are building amazing AI powered products with amazing people. THE ROLE AMD’s Data Center GPU and Accelerated Processing (DCGAP) division is looking for a talented and energetic Lead Printed Circuit Board (PCB) manufacturing process engineer to complement the existing skillsets of our Platform Development team. In this role, you will be responsible for driving the development of PCB performance, quality and reliability specifications, including high-speed signal integrity optimized board stacks and interconnect structures for mass volume manufacturing. To accomplish this, you will need to interact frequently with key engineering teams such as silicon design, boarding engineering, SI/PI engineering, system validation, device failure analysis and supply chain/manufacturing leaders within AMD, industry consortiums, our customer teams, and strategic ODM and joint development partners. THE PERSON PCB Manufacturing Engineers are responsible for ensuring best-in-class performance and reliability of cutting-edge PCB designs. The suitable candidate will require a strong background in high performance electronics hardware, technical expertise in PCB assembly reliability test/failure analyses, and understanding of complex PCB fabrication processes. Effective communication skills, a collaborative mindset, detail-orientation, innovative critical problem solving/ troubleshooting, and organized data collection are critical qualities for success in this role. KEY RESPONSIBILITIES Design high performance PCB stack and interconnect solutions to enable AMD's next generation of Datacenter GPU Platforms Own manufacturing process qualification & adoption of PCB process technologies addressing product thermal-mechanical, and SI/PI-related performance specifications Identify and investigate novel PCB fabrication process techniques to evaluate alignment of these technologies to AMD’s DCGPU Platform roadmap Collaborate with silicon design engineering, board engineering, power engineering and other cross-functional teams to support PCB solutions from package to system level Contribute to the overall product cycle from conceptualization through mass production Drive process improvements while executing fast time-to-market product delivery Work effectively in a dynamic and fast-paced product development environment PREFERRED EXPERIENCE The selected candidate will use their proven technical skills to ensure engineering teams continually innovate and use ‘best known methods/practices’, thereby adding value for customers. Strong background in high-speed PCB design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use Expertise in destructive and non-destructive device failure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA etc), and FTIR Spectroscopy Familiarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for Signal Integrity and Power Delivery-focused interconnect optimizations Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for statistical data analysis & tool development Excellent verbal & written communication skills at engineering and executive levels, including a proven track record of working effectively across organizational boundaries to define process requirements, solve complex problems and drive program-related investigations to successful completion Laboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis Manufacturing - Sound knowledge of Design for Manufacturing guidelines, including experience with volume manufacturing in Asia as well as in North America ACADEMIC CREDENTIALS B. Sc. in Engineering (Electrical/Computer/Mechanical/Chemical…etc.) is required MS in Electrical/Electronics and Computer Engineering is preferred LOCATION Austin Texas or Hybrid (Remote + occasional travel to Austin TX, other North America & international locations) #LI-RW1 #LI-HYBRID

At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Tags: No, USD $168,560.00/Yr., USD $240,800.00/Yr., US Careers (External)