Senior/ Staff Packaging Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. AMD together we advance_ THE ROLE: Lead experimental validation and characterization of advanced packaging solutions such as 2.5D/3D, power delivery and HSIO solutions. Responsibilities include thermal, mechanical and electrical characterization of passive devices like capacitors, resistors and voltage regulators and establishing core packaging lab capabilities. The ideal candidate is a highly collaborative leader with strong technical background in semiconductor packaging, metrology, and characterization who will ensure alignment with technology and product roadmaps. KEY RESPONSIBILITIES: Advanced Packaging Solutions: drive experimental validation and characterization of advanced packaging solutions such as 2.5D/EFB/CoWoS/WLFO, CoW/WoW 3D die stacking, BSPDN, power delivery, HSIO & connector technologies. Technology & Product Roadmap enablement: define and lead comprehensive material, process, and design characterization aligned to technology and product roadmaps. Strategic Partnerships: cultivate strong, strategic partnerships with internal engineering teams across packaging, reliability, device analysis, test, technology integration, and product development, and build collaborative relationships with external partners to leverage their expertise and resources. Data Collection & Analysis: lead collaborations with internal teams (characterization labs, reliability, failure analysis, design, test) and external partners (foundries, OSATs, suppliers, universities) for data collection and analysis. Technical Leadership: provide expert guidance on metrology and package characterization techniques. Stay abreast of industry trends and advancements in semiconductor packaging and characterization. Mentor and guide junior engineers and technicians. PREFERRED EXPERIENCE: 5+ years of experience in packaging, metrology, characterization, design validation of components, packages, and platforms. Experience with a variety of characterization methods including optical/electron microscopy, thermal-mechanical testing (micromechanical testers, DIC, DMA, TMA, DSC, rheometer), shadow moire, x-ray imaging, spectroscopy (EDS, FTIR, XRF), and chromatography (IC, GC-MS). Experience with data collection and analysis, including statistical methods. Demonstrated ability to work independently and in a team environment. ACADEMIC CREDENTIALS: Advanced degree (MS minimum, PhD preferred) in mechanical engineering, electrical engineering, material science, physics or equivalent. LOCATION: Singapore #LI-MM1 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

THE ROLE: Lead experimental validation and characterization of advanced packaging solutions such as 2.5D/3D, power delivery and HSIO solutions. Responsibilities include thermal, mechanical and electrical characterization of passive devices like capacitors, resistors and voltage regulators and establishing core packaging lab capabilities. The ideal candidate is a highly collaborative leader with strong technical background in semiconductor packaging, metrology, and characterization who will ensure alignment with technology and product roadmaps. KEY RESPONSIBILITIES: Advanced Packaging Solutions: drive experimental validation and characterization of advanced packaging solutions such as 2.5D/EFB/CoWoS/WLFO, CoW/WoW 3D die stacking, BSPDN, power delivery, HSIO & connector technologies. Technology & Product Roadmap enablement: define and lead comprehensive material, process, and design characterization aligned to technology and product roadmaps. Strategic Partnerships: cultivate strong, strategic partnerships with internal engineering teams across packaging, reliability, device analysis, test, technology integration, and product development, and build collaborative relationships with external partners to leverage their expertise and resources. Data Collection & Analysis: lead collaborations with internal teams (characterization labs, reliability, failure analysis, design, test) and external partners (foundries, OSATs, suppliers, universities) for data collection and analysis. Technical Leadership: provide expert guidance on metrology and package characterization techniques. Stay abreast of industry trends and advancements in semiconductor packaging and characterization. Mentor and guide junior engineers and technicians. PREFERRED EXPERIENCE: 5+ years of experience in packaging, metrology, characterization, design validation of components, packages, and platforms. Experience with a variety of characterization methods including optical/electron microscopy, thermal-mechanical testing (micromechanical testers, DIC, DMA, TMA, DSC, rheometer), shadow moire, x-ray imaging, spectroscopy (EDS, FTIR, XRF), and chromatography (IC, GC-MS). Experience with data collection and analysis, including statistical methods. Demonstrated ability to work independently and in a team environment. ACADEMIC CREDENTIALS: Advanced degree (MS minimum, PhD preferred) in mechanical engineering, electrical engineering, material science, physics or equivalent. LOCATION: Singapore #LI-MM1

Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Tags: No, SGD $109,900.00/Yr., SGD $157,000.00/Yr., Global Careers (do not use for US or Canada)