Senior Analog Design Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. The ROLE: The Packaging Signal Integrity engineering team ensures that the performance requirements of the silicon and the cost requirements of the product are met through the integration of silicon, package and platform electrical design. Packaging Signal Integrity also provides design support to engineering design teams for both current and forward-looking product development and feasibility studies. The PERSON: The ideal candidate has the ability to effectively communicate ideas and results. Additionally, the candiate will collaborate and work both independently and harmoniously with others. KEY RESPONSIBILITES: Responsible for early exploration and development of advanced chiplet architectures including novel packaging solutions and custom silicon. You will work on emerging I/O standards development and ensure product manufacturability based on current and forward-looking technology roadmaps. Active engagement required with multiple disciplines: circuit design, mechanical, thermal, and product engineering to solve multi-physics problems. PREFERRED EXPERIENCE: Experience with PCB, Package and IC level power delivery networks Experience in silicon packaging and PCB design for signal and power integrity Prefer chiplet/MCM packaging knowledge Experience with high-speed digital signaling interfaces such as PCIE, GDDR6, HBM, HDMI Expertise in electrical modeling EDA and AMS tools such as HFSS, SIwave, HSPICE Expertise in electromagnetic theory and circuit analysis Experience with programming in Python or Matlab ACADEMIC CREDENTIALS: MS or Ph.D. preferred LOCATION: Boxborough, Massachusets This role is not eligible for visa sponsorship. #LI-SC3 #LI-HYBRID Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

The ROLE: The Packaging Signal Integrity engineering team ensures that the performance requirements of the silicon and the cost requirements of the product are met through the integration of silicon, package and platform electrical design. Packaging Signal Integrity also provides design support to engineering design teams for both current and forward-looking product development and feasibility studies. The PERSON: The ideal candidate has the ability to effectively communicate ideas and results. Additionally, the candiate will collaborate and work both independently and harmoniously with others. KEY RESPONSIBILITES: Responsible for early exploration and development of advanced chiplet architectures including novel packaging solutions and custom silicon. You will work on emerging I/O standards development and ensure product manufacturability based on current and forward-looking technology roadmaps. Active engagement required with multiple disciplines: circuit design, mechanical, thermal, and product engineering to solve multi-physics problems. PREFERRED EXPERIENCE: Experience with PCB, Package and IC level power delivery networks Experience in silicon packaging and PCB design for signal and power integrity Prefer chiplet/MCM packaging knowledge Experience with high-speed digital signaling interfaces such as PCIE, GDDR6, HBM, HDMI Expertise in electrical modeling EDA and AMS tools such as HFSS, SIwave, HSPICE Expertise in electromagnetic theory and circuit analysis Experience with programming in Python or Matlab ACADEMIC CREDENTIALS: MS or Ph.D. preferred LOCATION: Boxborough, Massachusets This role is not eligible for visa sponsorship. #LI-SC3 #LI-HYBRID

Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

Tags: Yes, USD $116,970.00/Yr., USD $167,100.00/Yr., US Careers (External)