Power Debug Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING 

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.  

THE ROLE:

Technical, hands-on engineer responsible for post-silicon manufacturing validation and debug of AMD Data Center GPU products, with end-to-end ownership of power, thermal, voltage, and frequency (PTVF) characterization and test coverage optimization.

 

KEY RESPONSIBILITIES:

• Manufacturing Test Coverage Development: Define and deploy robust post-silicon manufacturing test plans to ensure comprehensive coverage across power, thermal, voltage, and frequency operating conditions.
• Silicon Debug & Root Cause Analysis: Lead deep-dive debug of manufacturing and system-level failures, driving rapid root cause identification across silicon, firmware, platform, and test infrastructure.
• PPA Optimization & Characterization: Analyze PPA (Power, Performance, Area) trade-offs and optimize coverage to ensure product meets performance targets while maintaining thermal and power efficiency across HVM conditions.
• Voltage/Frequency & Thermal Validation: Validate stability and guard-banding across DVFS states, thermal corners, and real-world workloads to ensure robust operation under diverse deployment scenarios.
• Yield & Quality Improvement: Drive data-driven insights from manufacturing and field returns to improve test effectiveness, enhance fault detection, and increase final product yield and reliability.
• Cross-Functional Collaboration: Partner with silicon design, firmware, platform, and manufacturing teams to close gaps, implement design/test fixes, and enable scalable validation flows for volume production.

PREFERRED EXPERIENCE:

• Strong Post-Silicon Debug Expertise:
  Proven experience in silicon bring-up, manufacturing test debug, and failure analysis for complex SoCs or GPU/CPU platforms.
• Deep PPA / PTVF Domain Knowledge:
  Solid understanding of power management, DVFS, thermal behavior, voltage guard-banding, and performance optimization in high-performance computing systems.
• Manufacturing Test & Coverage Development:
  Experience designing and optimizing high-volume manufacturing test flows (ATE, system-level test) with focus on coverage efficiency and defect screening.
• Hands-On Debug Skills:
  Strong capability in lab-based and fleet-level debug using logs, telemetry, and instrumentation; comfortable working across Linux environments, scripting (Python/Bash), and data analysis.
• Cross-Layer Debug Capability:
  Ability to root-cause issues across hardware, firmware, drivers, and system interactions with a structured, data-driven approach.
• Data Analytics & Insight Generation:
  Skilled in analyzing large-scale manufacturing or fleet data to identify trends, systematic failures, and opportunities for yield/quality improvement.
• High-Performance Platform Experience:
  Prior experience with datacenter GPUs/accelerators, servers, or large-scale compute systems is highly desirable.
• Cross-Functional Collaboration & Leadership:
  Demonstrated ability to lead debug efforts across global teams and influence design/test decisions to improve product quality and manufacturability.

ACADEMIC CREDENTIALS:

• Bachelor’s degree or higher in Electrical/Computer Engineering or Electronics / Mechanical Engineering related with a minimum 5-7 years of experience in SoC thermal validation and debug.

LOCATION:

Penang, Malaysia

 

#LI-SJ1

#LI-Hybrid

Benefits offered are described: AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

 

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

 

This posting is for an existing vacancy.

THE ROLE:

Technical, hands-on engineer responsible for post-silicon manufacturing validation and debug of AMD Data Center GPU products, with end-to-end ownership of power, thermal, voltage, and frequency (PTVF) characterization and test coverage optimization.

 

KEY RESPONSIBILITIES:

• Manufacturing Test Coverage Development: Define and deploy robust post-silicon manufacturing test plans to ensure comprehensive coverage across power, thermal, voltage, and frequency operating conditions.
• Silicon Debug & Root Cause Analysis: Lead deep-dive debug of manufacturing and system-level failures, driving rapid root cause identification across silicon, firmware, platform, and test infrastructure.
• PPA Optimization & Characterization: Analyze PPA (Power, Performance, Area) trade-offs and optimize coverage to ensure product meets performance targets while maintaining thermal and power efficiency across HVM conditions.
• Voltage/Frequency & Thermal Validation: Validate stability and guard-banding across DVFS states, thermal corners, and real-world workloads to ensure robust operation under diverse deployment scenarios.
• Yield & Quality Improvement: Drive data-driven insights from manufacturing and field returns to improve test effectiveness, enhance fault detection, and increase final product yield and reliability.
• Cross-Functional Collaboration: Partner with silicon design, firmware, platform, and manufacturing teams to close gaps, implement design/test fixes, and enable scalable validation flows for volume production.         

PREFERRED EXPERIENCE:

• Strong Post-Silicon Debug Expertise:
  Proven experience in silicon bring-up, manufacturing test debug, and failure analysis for complex SoCs or GPU/CPU platforms.
• Deep PPA / PTVF Domain Knowledge:
  Solid understanding of power management, DVFS, thermal behavior, voltage guard-banding, and performance optimization in high-performance computing systems.
• Manufacturing Test & Coverage Development:
  Experience designing and optimizing high-volume manufacturing test flows (ATE, system-level test) with focus on coverage efficiency and defect screening.
• Hands-On Debug Skills:
  Strong capability in lab-based and fleet-level debug using logs, telemetry, and instrumentation; comfortable working across Linux environments, scripting (Python/Bash), and data analysis.
• Cross-Layer Debug Capability:
  Ability to root-cause issues across hardware, firmware, drivers, and system interactions with a structured, data-driven approach.
• Data Analytics & Insight Generation:
  Skilled in analyzing large-scale manufacturing or fleet data to identify trends, systematic failures, and opportunities for yield/quality improvement.
• High-Performance Platform Experience:
  Prior experience with datacenter GPUs/accelerators, servers, or large-scale compute systems is highly desirable.
• Cross-Functional Collaboration & Leadership:
  Demonstrated ability to lead debug efforts across global teams and influence design/test decisions to improve product quality and manufacturability.

ACADEMIC CREDENTIALS:

• Bachelor’s degree or higher in Electrical/Computer Engineering or Electronics / Mechanical Engineering related with a minimum 5-7 years of experience in SoC thermal validation and debug.

LOCATION:

Penang, Malaysia

 

#LI-SJ1

#LI-Hybrid

Benefits offered are described:  AMD benefits at a glance.

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

 

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD’s “Responsible AI Policy” is available here.

 

This posting is for an existing vacancy.

Tags: No, MYR RM126,000.00/Yr., MYR RM180,000.00/Yr., Global Careers (do not use for US or Canada)