Packaging Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: As a Package Architecture Design Engineer, you will be the technical pivot between Silicon Design, System Hardware, and Manufacturing. You will define the physical architecture of next-generation products and customized ASIC, ensuring that the package technology meets aggressive performance, power, and thermal requirements while maintaining cost-efficiency and high yield.   KEY RESPONSIBILITIES: Architecture Definition: Define optimal package solutions (e.g., Flip-Chip BGA, 2.5D/3D IC, Chiplet, CoWoS, or InFO, etc…) based on product specs. Feasibility & Pathfinding: Conduct package routing feasibility studies and ball-map optimization to ensure SI/PI targets are met. Chip-Package-System Co-Design: Collaborate with IC Designers and PCB Engineers to optimize the end-to-end interconnection, focusing on PDN and high-speed I/O design (SerDes, PCIe, UCIe, DDR, HBM). Substrate Specification: Define substrate stack-up, material selection, and design rules; drive Design for Manufacturing (DFM) reviews with OSAT partners. Modeling & Simulation: Work with Thermal and Mechanical engineers to assess package warpage, thermal resistance, and structural reliability under various operating conditions. PREFERRED EXPERIENCE: Experience in packaging design for customized products. Strong knowledge in package reliability and qualification item. Good leadership and cross-functional communication skill, and the ability to drive technical decisions under tight deadlines. Familiar with tools: APD / AutoCAD Experience: 5+ years of experience in IC packaging design or architecture. ACADEMIC CREDENTIALS: Bachelor/MS degree in Mechanical, Material, Chemical Engineering, or a related field. #LI-SH1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

THE ROLE: As a Package Architecture Design Engineer, you will be the technical pivot between Silicon Design, System Hardware, and Manufacturing. You will define the physical architecture of next-generation products and customized ASIC, ensuring that the package technology meets aggressive performance, power, and thermal requirements while maintaining cost-efficiency and high yield.   KEY RESPONSIBILITIES: Architecture Definition: Define optimal package solutions (e.g., Flip-Chip BGA, 2.5D/3D IC, Chiplet, CoWoS, or InFO, etc…) based on product specs. Feasibility & Pathfinding: Conduct package routing feasibility studies and ball-map optimization to ensure SI/PI targets are met. Chip-Package-System Co-Design: Collaborate with IC Designers and PCB Engineers to optimize the end-to-end interconnection, focusing on PDN and high-speed I/O design (SerDes, PCIe, UCIe, DDR, HBM). Substrate Specification: Define substrate stack-up, material selection, and design rules; drive Design for Manufacturing (DFM) reviews with OSAT partners. Modeling & Simulation: Work with Thermal and Mechanical engineers to assess package warpage, thermal resistance, and structural reliability under various operating conditions. PREFERRED EXPERIENCE: Experience in packaging design for customized products. Strong knowledge in package reliability and qualification item. Good leadership and cross-functional communication skill, and the ability to drive technical decisions under tight deadlines. Familiar with tools: APD / AutoCAD Experience: 5+ years of experience in IC packaging design or architecture. ACADEMIC CREDENTIALS: Bachelor/MS degree in Mechanical, Material, Chemical Engineering, or a related field. #LI-SH1 #LI-HYBRID

Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

Tags: No, TWD NT$1,645,350.00/Yr., TWD NT$2,350,500.00/Yr., Global Careers (do not use for US or Canada)