Senior IC Package Mechanical and Thermal Design Engineer

- Bachelor's degree in Electrical Engineering or a related field
- Master's degree in Mechanical or Electrical Engineering or a related field
- Knowledge of SoC architecture
- Experience with microelectronic packaging

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Annapurna Labs is a semiconductor company established by semiconductor industry veterans and is now part of Amazon Web Services (AWS).
We are developing leading edge products, manufactured on leading edge technologies.
We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities
– Assume full ownership of mechanical and thermal design of Annapurna ICs.
– Engage with product architect and design teams on future products package and assembly needs
– Perform package level thermal simulations.
– Perform package level mechanical simulations.
– Lead and design thermal and mechanical measurements of ICs.
– Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna’s products.
– Engage with substrate and assembly vendors on future technologies roadmap.
– In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
– Ensure testability of the ICs in collaboration with Test Engineer team.


About the team
Diverse Experiences
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