Engineer / Senior Flip Chip Die Attach / Underfill Process Development Engineer

Company Description

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk® and WD® brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Job Description

• Responsible for Flip Chip Die Attach & Under Fill New Process Development for new product and new process development.
• Supports New Product Introduction by delivering assigned Process and Equipment solutions meeting quality, development, and operation targets and requirements.
• New process development for new wafer technology, next generation products, new material / machine / tooling / software qualifications.
• Define Leading edge Flip Chip Die Attach & Underfill Technology Roadmap / building block.
• Setup new Flip Chip Die Attach & Underfill processes, recipe, perform complete window study, DOEs, corner limits.
• Golden recipe setup for new package qualification.
• Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
• To introduce new products and devices to the production line and to build new process technology capabilities, make sure that the handshake and process handover are done effectively.
• Support new material and tools qualification.
• Work closely with Cross site’s Package development & design team to understand the Package Design Rules & Requirements.
• Strong problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
• Responsible and accountable to related tasks as assigned by superior.

Qualifications

• Min Bachelor or higher Engineering degree (Electrical Engineering, Mechanical Engineering, Physics & etc).
• Min 3-5 years of experience in Flip Chip / Underfill / Die Attach process development preferred.
• Hands on personality – production line and quality focus personnel.
• Knowledge in Semiconductor assembly processes is a plus point.
• Knowledge in Datacon Flip Chip bonder is a plus point.
• Knowledge in Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC), 8D Problem Solving, 6 Sigma certification, Design Of Experiment (DOE), Minitab, JMP is an added advantage.
• Self- motivated, possess initiatives and ability to lead and work independently.
• Good project planning, strong sense of quality and urgency.
• Team player with good communication and interpersonal skills.

Additional Information

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@wdc.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@wdc.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital’s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to compliance@wdc.com.