Job Details:

Job Description: 

• Improving and sustain the HDMT/x collateral healthiness and process to meet safety, quality, productivity.

• Defining or improving process control systems related to module to prevent excursions.

• Able to do data analysis and problem solving such as Commonality Analysis, MBPS,...

• Work with senior engineer to analyze Test Collateral Specification versus Test program limits/content/execution for Yield/Retest improvement.

Qualifications:

Qualification:

• Able to do data analysis and problem solving such as Commonality Analysis, 5why.

• Has electronic/circuit basic knowledge.

• Has ability to Inspect electronic systems, instruments and equipment to ensure they meet applicable regulations and safety standards.

          

Job Type:

Student / Intern

Shift:

Shift 1 (Vietnam)

Primary Location: 

Vietnam, Ho_Chi_Minh_City

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.

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