Job Details:

Job Description: 

Our External Manufacturing Production (EMP) group is responsible for high volume manufacturing (HVM) phase products.

This Test Development engineering role responsible to but not limited to:

• Responsible for ensuring the yield, test time, test stability, and manufacturability of integrated circuits from the production ramp to HVM.
• Responsible for test program content readiness. Evaluation, development, and debug of complex Test program test methods codes on ATE. Familiar with NPI content bring up process.
• Develops and debugs complex software programs to convert design validation vectors for ATE test coverage implementation.
• Willing to drive DOEs for yield improvements and TTR activities.
• Evaluate and drive Test Program specification optimization to ensure optimal match of mass production requirements with process and production capability with specific emphasis on yield improvements.
• Drive, Creates and applies concepts for optimizing component production relative to both quality and cost constraints.

As a successful candidate, you must have:

• Good communication skills and willing to interface/communicate effectively with all levels, BU and OSATs
• Strong pareto analysis experience to drive a debug process and problem-solving skills.
• Familiar with both wafer probers, probe technology, handler, automated thermal control

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Bachelor/master’s degree in electronic engineering or computer engineering.
• 5+ years of experience in semiconductor product test development.
• 5+ years ATE experience with Advantest V93K, T2K, Teradyne J750/uFlex or HDMT ATE platform. HDMT experience is a PLUS.
• 5+ years of experience with developing tests, patterns/vectors, timing, and diagnostics on Automated Test Equipment. IP knowledge on either SCAN, MBIST, HSIO, DDR, LPDDR, Thermal, Power, Func or RF test development experience.

Preferred Qualifications:

• PCB design along with electric and components.
• Programming skill on C/C++, VB, Java, Python.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Business group:

Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.