Job Details:

Job Description: 

Do Something Wonderful!

Intel put the Silicon in Silicon Valley. No one else is this obsessed with engineering a brighter future. Every day, we create world changing technology that enriches the lives of every person on earth. So, if you have a big idea, let's do something wonderful together. Join us, because at Intel, we are building a better tomorrow. 

Who We Are

Join the Manufacturing and Product Engineering Team (MPE)! We drive the 5G and Networking product development from pre-silicon to post-silicon manufacturing. The candidate we are looking for will help improve product health indicator's and manufacturing test cost.

Who You Are

The key responsibilities of this person include the following:

• Drives and develops testability and manufacturability of integrated circuits from the component feasibility stage through production ramp with Fab, Sort, Design, PDE and Test Factory team.
• Contributes to design, development, and validation of testability circuits, test flows, and methodologies for new products through evaluation, development, and debug of complex test methods.
• Evaluates new designs on automatic test equipment (ATE) and works with the design, DFx, and product development teams to debug functionality and performance issues for product quality improvement.
• Drives test time reduction, manufacturing socket elimination, yield improvement and other critical Product Health Indicators (PHI) through defects debug/isolation, AI & ML solutions, test flows and contents optimization for best-in-class test cost delivery.
• Leads and drives manufacturing readiness from fab, assembly, and foundry to support sample generation, wafer start planning and product qual execution strategy in securing world class time-to-market.
• Analyzes early customer returns with emphasis on driving test hole closure activities with system validation, components debug and failure analysis team.

The ideal candidate will exhibit:

• Strong analytical and problem-solving skills with a proven track record of creating and implementing integrated, multidiscipline solutions.
• Ability to work in unstructured environments and to initiate and drive new model path finding activity from ambiguity (concepts) to clarity (defined direction and development)
• Exceptional interpersonal communication, relationship management, effective listening and influencing skills that result in strong working partnerships across organization boundaries.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Candidate must possess a Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science or a related field with 6+ years' experience -OR- a Master's degree in Electrical Engineering, Computer Engineering, Computer Science or a related field with 4+ years' experience -OR- PhD degree in Electrical Engineering, Computer Engineering, Computer Science or a related field with 2+ years' experience.

Experience should be concentrated in the following areas:

• Microprocessor test (ATE and/or system test and/or pre-silicon verification) experience
• Experience in pre-silicon and post-silicon test development.
• Strong background and knowledge in hardware architecture, analog/logic/memory design and implementation.

Preferred Qualifications:

• Knowledge of circuit design/Si process/test domains.
• Chipset integrated circuit testing and high-volume manufacturing experience would be an added advantage.
• Experience in Silicon debug.
• Experience with post silicon validation concepts/methods including: High Volume Manufacturing (HVM), test flows including die level/package level testing, test stimulus and coverage approaches.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Texas, Austin

Additional Locations:

US, Arizona, Phoenix

Business group:

In the Design Engineering Group (DEG), we take pride in developing the best-in-class SOCs, Cores, and IPs that power Intel’s products. From development, to integration, validation, and manufacturing readiness, our mission is to deliver leadership products through the pursuit of Moore’s Law and groundbreaking innovations.  DEG is Intel’s engineering group, supplying silicon to business units as well as other engineering teams.  As a critical provider of all Intel products, DEG leadership has a responsibility to ensure the delivery of these products in a cost efficient and effective manner.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.