Description
Job Details:
Job Description:
As an Global Logistics Engineering Intern, you'll works in developing cutting-edge technologies like deep learning, neuro-linguistic programming (NLP), chatbots together with engineering team to improve various business process and driving intelligence software innovation solutionQualifications:
Qualifications: � Pursuing a degree in Data Science , Computer Science, Engineering, or related field. � Good understanding of AI concepts, machine learning, and deep learning. � Proficiency in programming languages such as Python, C++, Bash, Bat, Linux/Ubuntu is a plus. � Excellent problem-solving skills and ability to work collaboratively in a multidisciplinary team.
Job Type:
Student / InternShift:
Shift 1 (Malaysia)Primary Location:
Malaysia, PenangAdditional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust
N/AWork Model for this Role
This role will require an on-site presence.
Intel
Artificial Intelligence (AI)
Information Technology
Product Design
Semiconductor
Software
1 applies
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