Material and Process Engineer – Advanced Microelectronics Packaging (Senior or Lead)

Material and Process Engineer – Advanced Microelectronics Packaging (Senior or Lead)

Company:

The Boeing Company

Job ID:

00000424571

Date Posted:

2024-05-06

Location:

USA - El Segundo, CA

Job Description Qualifications:

At Boeing, we create the future — of mobility, autonomy, speed, endurance, space access and exploration, undersea vehicles, cybersecurity, communication and much, much more.  We connect people, products, and ideas around the world.  We protect people and nations.  We explore the mysteries of the universe from seabed to space to cyberspace.  We inspire future generations of innovators, dreamers, and doers.

We are Boeing Research and Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace.  We are engineers and technicians, skilled scientists, and bold innovators.  Join us and put your passion, determination, and skill to work building the future!

BR&T is looking to hire a Material and Process Engineer – Advanced Microelectronics Packaging who will provide support to various space and defense programs, in El Segundo, California. Our teams are currently hiring for a broad range of experience levels including Senior or Lead Material and Process Engineers.

The Materials and Process Group in El Segundo develops, provides, and maintains technical competency and integrity in the definition, evaluation, analysis, management, selection and control of materials, processes, and parts.  In this role, you will be responsible for the development, implementation, and continuous improvement of manufacturing equipment, tools, and processes.

The ideal candidate has a background with materials science and extensive experience with microelectronics process development and production engineering.

Position Responsibilities:

• Assists with definition of requirements for tools, equipment, materials, parts and processes used in the engineering design, manufacture and/or maintenance of Boeing products
• Drafts engineering specifications and other documents to manage the deployment of tools, equipment, materials, parts and processes
• Assists with evaluation of emerging technologies for potential application to business needs
• Assists with development and qualification of new tools, equipment, materials, parts and processes to meet requirements
• Performs routine tests and audits to qualify suppliers to applicable requirements
• Conducts routine analysis to determine performance or reasons for failures of tools, materials, parts or processes
• Assists with implementing corrective and preventive actions
• Develops computer and production systems to satisfy user requirements
• Uses project management tools to meet cost, technical, and schedule requirements
• Incorporates environmental health and safety, LEAN and Quality principles into (1) materials and processes, (2) research, design and qualification, (3) work procedures and (4) labs and office areas
• Design and development of microelectronic packaging approaches for advanced electronics
• Leads development of manufacturing and assembly for advanced heterogeneous integration
• Establish and stand up new in-house production capabilities from process to equipment to facilities
• Supports external partners for development and production of custom designs
• Leads and mentors’ junior engineers and technical teams
• Stay updated with the latest industry trends and technologies in advanced packaging
• Documents and presents technical findings and developments to stakeholders and at industry conferences

This position is expected to be 100% onsite.  The selected candidate will be required to work onsite at the listed location.

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Top Secret/Sensitive Compartment Information (SCI) clearance Post-Start is required.

Basic Qualifications (Required Skills/Experience):

• Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science
• 10+ years of leadership within the microelectronic field
• 5+ years of experience with lab tools and general purpose lab equipment
• 5+ years of experience with implementing and monitoring statistical process controls

Preferred Qualifications (Desired Skills/Experience):

• 15+ years' related work experience or an equivalent combination of education and experience
• 15+ years of experience of development, verification, and qualification of microelectronic heterogeneous integration capabilities
• Active Top Secret/Sensitive Compartment Information (TS/SCI) security clearance
• Experience within aerospace or related industry or with space electronics
• Experience with CAD, Finite Element Analysis (FEA), MES, Statistical Software (JMP, Minitab, etc.)
• Experience and skills to collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources
• Experience leading teams on complex projects
• Experience reading and interpreting engineering documents, specifications, and drawings
• Experience with process development
• Experience with establishing production lines including facility planning
• Experience with equipment identification, validation, and implementation
• Experience working in a production environment
• Excellent oral and written technical communication skills and ability to communicate across multiple disciplines with internal and external customers

Typical Education/Experience: 
 

Senior (Level 4):

Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 9 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+4 years' related work experience, Master+7 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Lead (Level 5):

Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 14 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+9 years' related work experience, Master+12 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Relocation:
This position offers relocation based on candidate eligibility.

Drug Free Workplace:

Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.

Shift Work Statement:

This position is for 1st shift.

At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent.  Elements of the Total Rewards package include competitive base pay and variable compensation opportunities. 

The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work. 

The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.

Pay is based upon candidate experience and qualifications, as well as market and business considerations. 

Summary pay range for Senior level: $124,950 – $169,050

Summary pay range for Lead level: $150,450 – $203,550

Applications for this position will be accepted through May, 20, 2024.

Boeing is the world's largest aerospace company and leading manufacturer of commercial airplanes and defense, space and security systems. We are engineers and technicians. Skilled scientists and thinkers. Bold innovators and dreamers. Join us, and you can build something better for yourself, for our customers and for the world.

Relocation:

Relocation is available for eligible candidates, if authorized

Export Control Requirement:

U.S. Government Export Control Status: This position must meet export control compliance requirements. To meet export control compliance requirements, a “U.S. Person” as defined by 22 C.F.R. §120.15 is required. “U.S. Person” includes U.S. Citizen, lawful permanent resident, refugee, or asylee.

Safety Sensitive:

This is not a safety sensitive position

Contingent Upon Award Program

This position is not contingent upon program award

Experience Level:

Individual Contributor - 4

Job Type:

Regular

Job Code:

6F4BI4 (6B2)

Equal Employment Opportunity:

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